| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mechanical quantity sensor which can achieve simplification of a wiring line when the sensor has been configured by using a laminated substrate provided with a thin film semiconductor layer through an insulating film on a support substrate. SOLUTION: In this sensor, SOI substrate 1 is used to form a first condenser component part E1, a second condenser component part E2 and a third condenser component part E3. While carrier wave voltage is impressed to a movable electrode part on each beam structure of the first and third condenser component parts E1 and E3, each movable electrode part is displaced in the direction perpendicular to the surface of the support substrate 2 by the action of acceleration to change capacities C1, C3 between each movable electrode part and the support substrate 2. Then an opposite electrode part 20 for signal lead-out of the second condenser component part E2 is formed as a compartment with an insulating film 3 existed under it, variation in capacity difference between capacities C1 and C3 is led out from the opposite electrode part 20 for signal lead-out. COPYRIGHT: (C)2009,JPO&INPIT
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