| 摘要 |
The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700 . The assembly 400 uses no solder. Components 406 , or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808 . The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412 . Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.
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