RESIN FILM WITH METAL LAYER, ITS FORMING METHOD, AND FLEXIBLE PRINTED BOARD MANUFACTURING METHOD USING THE FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a resin film with a metal pattern which is useful to prevent a position shift and a handling failure that are liable to result in a process of applying a cover ray and a reinforcement film in preparing a flexible printed wiring board. SOLUTION: The method for forming a resin film with a metal pattern includes a process which patterns the metal layer of the resin film 10 with a metal layer that has an area where the metal layer 22 exists and an area where the metal layer does not exist to form a metal pattern 24 on the surface of a resin film base 12, a process which applies an adhesive resin on the area where the metal layer does not exist to form an adhesive layer 26, and a process which laps the adhesive layer on the area where the metal pattern is formed and applies energy to it to join the metal pattern and the adhesive layer. COPYRIGHT: (C)2009,JPO&INPIT