发明名称 COMPOSITE SUBSTRATE CONTAINER WITH OVERMOLDED WAFER RETAINER
摘要 An overmolded wafer retaining structure for engaging the edges of wafers in a wafer container. The overmolded wafer retainer includes a base portion and an overmolded portion. The overmolded portion is injection molded onto the base portion to form a hermetic bond without need for external fasteners or adhesive. The wafer retainer is situated in a wafer container such as a standard mechanical interface (SMIF) pod or a front opening unified pod (FOUP) so that when the door is mounted to the container to form a closure, the retainer is brought into contact with an edge of the wafer or wafers.
申请公布号 WO2007146019(A3) 申请公布日期 2008.11.13
申请号 WO2007US13359 申请日期 2007.06.06
申请人 ENTEGRIS, INC.;SMITH, MARK, V.;BURNS, JOHN;KING, JEFFERY, J. 发明人 SMITH, MARK, V.;BURNS, JOHN;KING, JEFFERY, J.
分类号 B65D85/57;B65D85/30 主分类号 B65D85/57
代理机构 代理人
主权项
地址