COMPOSITE SUBSTRATE CONTAINER WITH OVERMOLDED WAFER RETAINER
摘要
An overmolded wafer retaining structure for engaging the edges of wafers in a wafer container. The overmolded wafer retainer includes a base portion and an overmolded portion. The overmolded portion is injection molded onto the base portion to form a hermetic bond without need for external fasteners or adhesive. The wafer retainer is situated in a wafer container such as a standard mechanical interface (SMIF) pod or a front opening unified pod (FOUP) so that when the door is mounted to the container to form a closure, the retainer is brought into contact with an edge of the wafer or wafers.
申请公布号
WO2007146019(A3)
申请公布日期
2008.11.13
申请号
WO2007US13359
申请日期
2007.06.06
申请人
ENTEGRIS, INC.;SMITH, MARK, V.;BURNS, JOHN;KING, JEFFERY, J.