HOLLOW CATHODE DISCHARGE SPUTTERING SYSTEM

摘要

A new the hollow cathode discharge sputtering system increasing the deposition area of substrate is provided. Moreover, the utilization ratio of the sputtering electrode is increased and a substrate surface deposit can be efficiently performed. A hollow cathode discharge sputtering system comprises as follows, A) a vacuum chamber(10) in which the gas injector and gas exhaust port are formed in one side; B) a plasma-generating of the discharge gas by the hollow cathode discharge it is posted at the vacuum inside of chamber; C) a power source(30) supplying the electric discharge energy to the hollow cathode discharge reactor; and D) a substrate(40) arranged in the lower part of the bottom plate.