| 摘要 |
PROBLEM TO BE SOLVED: To provide a disk substrate molding apparatus which rapidly feeds a disk substrate to a next process regardless of the position of a sprue when the disk substrate is taken out, and achieves the enhancement of productivity. SOLUTION: In the disk substrate molding method, after the disc substrate D and the sprue S are taken out by a substrate take-out robot 3, the disk substrate D is fed to a next process through a substrate receiving robot 4 while the sprue S is discharged to a recovery part. When a gate cutting process is performed by a protruded mold gate cutting system, the sprue S is allowed to fall from the substrate take-out robot 3 and discharged. When the gate cutting process is performed by a recessed mold gate cutting system, the sprue S is fed to the next process along with the disk substrate D through the substrate receiving robot 4 and allowed to fall on the way of feed and discharged. COPYRIGHT: (C)2005,JPO&NCIPI |
