MANUFACTURING METHOD FOR ELECTRONIC EQUIPMENT CASING, AND STRUCTURE OF ELECTRONIC EQUIPMENT CASING

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic equipment casing which is excellent in molding property and assembling property, and to provide a structure of the electronic equipment casing. SOLUTION: In this manufacturing method for the electronic equipment casing by a two-color molding with a primary molding section 10 by a casing main body, and a liquid silicon based adhesive 70, the edge of a seal-forming area of the primary molding section 10 is deformed by crushing the edge into a chamfered shape 11 by the pressing of a chamfering section 61 of a die 60 for the seal formation. Under a state in which the chamfering section 61 of the die 60 is being pressed to the chamfered shape 11, the liquid silicon based adhesive 70 is filled into the die 60. Thus, leakage from a space to the primary molding section 10 is prevented from occurring at the time of the filling of the liquid silicon based adhesive 70 into the die 60. COPYRIGHT: (C)2009,JPO&INPIT