| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor also having a high curing property while excellent in soldering-resistance and flame-resistance and excellent in flowability. <P>SOLUTION: The resin composition for sealing a semiconductor contains the compound (A) containing two or more of glycidyl ether groups, and the compound (B) represented by general formula (1). <P>COPYRIGHT: (C)2009,JPO&INPIT |
