发明名称 LEADING BOARD AUTOMATIC TAPE APPLYING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide an automatic tape applying machine for a leading board which is suitable for conveying an extra-thin printed circuit board. SOLUTION: A supply section 20 has a liftable table 21 for loading the leading board B. A placement section 30 has a moving table 31 onto which the leading board B is transferred from the liftable table 21. A tape loading device 40 applies tape T onto the leading board B placed on the moving table 31. A storage section 50 has a liftable table 51, where the leading board B having the tape T is transferred from the moving table 31 for stacking. A transfer device 60 sucks the leading board B for transfer. The tape loading device 40 applies the tape T onto the leading board B along the longitudinal direction of the leading board B so that the tape T projects from the end edge of the leading board B. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270711(A) 申请公布日期 2008.11.06
申请号 JP20070291854 申请日期 2007.11.09
申请人 MCK:KK;URI ENGINEERING CORP 发明人 LEE BUNKO;KAWAGUCHI YUTAKA
分类号 H05K3/00 主分类号 H05K3/00
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