DUMMY PATTERN ARRANGING DEVICE, DUMMY PATTERN ARRANGING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem that it is difficult to control reliability deterioration in semiconductor device operation owing to dust collected between patterns without increasing the volume of data required for dummy pattern arrangement. SOLUTION: The device 50 arranges a dummy pattern in a first region where first and second wiring patterns to extending along a first axis are arranged. It has a portion 54 for arranging a dummy pattern extending along a second axis between the first and second wiring patterns while separating it from both wiring patterns, and a patterning portion 56 for arranging a first dummy land on the first wiring pattern side by processing the first end of the dummy pattern thus arranged. COPYRIGHT: (C)2009,JPO&INPIT