Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package

摘要

Cap for airtight sealing ( 1 ) that not only suppresses any deterioration of the properties of electronic parts ( 20 ) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer ( 2 ); Ni-Co alloy layer ( 3 ) superimposed on the surface of the low thermal expansion layer and composed mainly of Ni wherein a diffusion acceleration material is contained; Ni layer ( 4 ) superimposed on the surface of the Ni-Co alloy layer; and solder layer ( 5 ) superimposed on the surface of the Ni layer at regions for bonding of electronic part accommodation member ( 10 ) and composed mainly of Sn. The Ni layer has the functions of not only suppressing any diffusion of the Ni-Co alloy layer into the solder layer at about 235° C. (first temperature) but also at bonding of the solder layer with the electronic part accommodation member at about 300° to about 320° C. (second temperature), diffusing the Ni-Co alloy layer via the Ni layer into the solder layer.