发明名称 Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates
摘要 A method and apparatus for fabrication of passivated microfluidic structures is disclosed. The method includes providing a substrate having a microfluidic structure formed therein. The microfluidic structure is embedded by an embedding layer. The method further includes passivating the embedded microfluidic structure by locally heating the microfluidic structure surface in a reactive atmosphere, wherein the passivated microfluidic structure is suitable for transporting a fluid. The structure optionally further includes metal pads to form an electrokinetic pump.
申请公布号 US7446382(B2) 申请公布日期 2008.11.04
申请号 US20040976928 申请日期 2004.10.28
申请人 INTEL CORPORATION 发明人 WINER PAUL;VAKANAS GEORGE P.
分类号 H01L27/14;B01L3/00;B81B1/00;B81C1/00;H01L29/82 主分类号 H01L27/14
代理机构 代理人
主权项
地址