发明名称 |
Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates |
摘要 |
A method and apparatus for fabrication of passivated microfluidic structures is disclosed. The method includes providing a substrate having a microfluidic structure formed therein. The microfluidic structure is embedded by an embedding layer. The method further includes passivating the embedded microfluidic structure by locally heating the microfluidic structure surface in a reactive atmosphere, wherein the passivated microfluidic structure is suitable for transporting a fluid. The structure optionally further includes metal pads to form an electrokinetic pump.
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申请公布号 |
US7446382(B2) |
申请公布日期 |
2008.11.04 |
申请号 |
US20040976928 |
申请日期 |
2004.10.28 |
申请人 |
INTEL CORPORATION |
发明人 |
WINER PAUL;VAKANAS GEORGE P. |
分类号 |
H01L27/14;B01L3/00;B81B1/00;B81C1/00;H01L29/82 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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