Interconnect structure for semiconductor package

摘要

A semiconductor device includes a semiconductor substrate having top and bottom surfaces, the top surface having at least one device region thereon. At least one trench opening is formed through the substrate from the bottom surface and connecting to the device region. A layer of conductive material is deposited in the at least one trench opening and partially fills the trench opening. A layer of conductive adhesive is deposited over the layer of conductive material and fills a remaining portion of the trench opening.