发明名称 |
Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like |
摘要 |
A sacrificial lead and a common lead hold a die paddle of each integrated circuit SOT-23 package to a leadframe within a strip of leadframes after isolating signal leads from the leadframe. Strip testing of most devices in the SOT-23 three and five lead packages may then be performed. The common lead may be at the center of an edge of the SOT-23 package. Also the common lead may be any one of the leads of the SOT-23 package. In addition the sacrificial lead may be at the center of an opposite edge of the SOT-23 package.
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申请公布号 |
US2008265248(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20080026625 |
申请日期 |
2008.02.06 |
申请人 |
MICROCHIP TECHNOLOGY INCORPORATED |
发明人 |
DRWINGA RANDALL L.;WILKIE DAVID L. |
分类号 |
H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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