发明名称 Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like
摘要 A sacrificial lead and a common lead hold a die paddle of each integrated circuit SOT-23 package to a leadframe within a strip of leadframes after isolating signal leads from the leadframe. Strip testing of most devices in the SOT-23 three and five lead packages may then be performed. The common lead may be at the center of an edge of the SOT-23 package. Also the common lead may be any one of the leads of the SOT-23 package. In addition the sacrificial lead may be at the center of an opposite edge of the SOT-23 package.
申请公布号 US2008265248(A1) 申请公布日期 2008.10.30
申请号 US20080026625 申请日期 2008.02.06
申请人 MICROCHIP TECHNOLOGY INCORPORATED 发明人 DRWINGA RANDALL L.;WILKIE DAVID L.
分类号 H01L23/58 主分类号 H01L23/58
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