发明名称 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
摘要 A method of fabricating a semiconductor device is disclosed. The method of fabricating a semiconductor device provides a semiconductor substrate; forming a gate stack overlying the semiconductor substrate; forming spacers each having a first inner spacer and a second outer spacer on sidewalls of the gate stack; forming a protective layer on sidewalls of the spacers, covering a part of the semiconductor substrate, wherein an etching selectivity of the protective layer is higher than that of the first inner spacer.
申请公布号 US2008268602(A1) 申请公布日期 2008.10.30
申请号 US20080013528 申请日期 2008.01.14
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHENG CHIEN-LI;CHANG SUN-JAY;HSIEH TUNG-HENG;CHEN YUNG-SHUN
分类号 H01L21/336;H01L21/28 主分类号 H01L21/336
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