发明名称 DIN RAIL MOUNTING ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a DIN rail mounting electronic apparatus which efficiently diffuses a heat caused by assembling a large number of fine heating parts loaded on a built-in circuit board outside a housing although the housing made from plastic with high design flexibility is used, and makes it possible to ensure an operating reliability by holding built-in circuit parts in a temperature warranty environment. SOLUTION: The apparatus has: a sheet shape thermal conduction gel 103 which is piled on a loading side of fine heating parts of a heating circuit board 104 so that a front side thereof may adhere to respective heating parts by covering the whole or almost whole of the heating parts; and a thermal conduction plate which is piled at a rear face side of the sheet shape thermal conduction gel 103 so that a front side thereof may adhere to the sheet shape thermal conduction gel 103 by covering the whole or almost whole of the sheet shape thermal conduction gel 103 by the front side thereof and which is formed using a metal with a good thermal conductivity, wherein part of the thermal conduction plate penetrates a housing back face wall and is drawn inside a DIN rail mounting groove to form a housing outside drawing portion 102c. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008263144(A) 申请公布日期 2008.10.30
申请号 JP20070106420 申请日期 2007.04.13
申请人 OMRON CORP 发明人 KIDO MASAKAZU;UEDA HIROAKI
分类号 H05K7/20;H05K7/12 主分类号 H05K7/20
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