| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit substrate capable of forming a convex pattern on a metal layer of a carrier where a metal layer is laminated, and forming a high density circuit pattern by transferring the convex pattern to an insulating layer. SOLUTION: The method for manufacturing the circuit substrate is characterized by comprising a step of forming a convex pattern corresponding to a circuit pattern on the metal layer of a carrier where a metal layer is laminated, a step of laminating and pressing the carrier on an insulating layer so as to allow the convex pattern to face the insulation layer, a step of transferring the metal layer and the convex pattern to the insulating layer by removing the carrier, a step of forming a via hole in the insulating layer where the metal layer is transferred, a step of filling the via hole by plating the insulating layer where the metal layer is transferred, and a step of forming a plating layer on the metal layer. COPYRIGHT: (C)2009,JPO&INPIT |
