| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for increasing a reliability in a semiconductor device. SOLUTION: A semiconductor device comprises a semiconductor chip (first semiconductor chip) 3 having a main surface (first main surface) 3a and a main surface (second main surface) 3b located at a position opposed to the main surface 3a, a lead frame (carrier substrate) for carrying the semiconductor chip 3, a resin film (first film layer) 7 tightly mounted onto the main surface 3b of the semiconductor chip 3, and an adhesive (first adhesive layer) 8 for tightly mounting the semiconductor chip 3 onto the lead frame. The Young's modulus of the adhesive 8 is set to be smaller than the Young's modulus of the resin film 7. COPYRIGHT: (C)2009,JPO&INPIT
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