| 摘要 |
A printed circuit board employing a heat sink retaining apparatus and method of use is disclosed. In one form of the disclosure, a heat sink apparatus can include a heat sink operable to be coupled to a first portion of a printed circuit board having an integrated circuit, and a retaining mechanism operably coupled along a first surface of the heat sink. The retaining mechanism can be coupled to a second portion of the printed circuit board to produce a tension between the first surface of the heat sink and the second portion of the printed circuit board.
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