发明名称 PLANARIZING COATING METHOD
摘要 A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest.
申请公布号 US2008254215(A1) 申请公布日期 2008.10.16
申请号 US20070937266 申请日期 2007.11.08
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 NAKAMURA AKIHIKO
分类号 B05D3/12 主分类号 B05D3/12
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