发明名称 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus having a reduced space and a substrate treatment method, capable of uniformly treating a surface to be treated of a substrate with a treatment liquid and excellently drying the substrate while preventing incomplete drying. SOLUTION: Opposite members 12A, 12B are disposed so as to be spaced while approximating to front and rear surfaces Wf and Wb of a substrate W held in an upright posture by holding rollers 11. Treatment liquids (chemical liquid and rinse liquid) are supplied to gap spaces S11, S12 until they are filled up, and the front and rear surfaces Wf and Wb of the substrate W are uniformly treated with the treatment liquids. Also, since the substrate W is held in the upright posture so that the treatment liquids can be dropped naturally when the substrate W is dried, the treatment liquid (rinse liquid) is extruded by jetting a drying gas, and the rinse liquid is removed from the front and rear surfaces Wf and Wb of the substrate W by utilizing gravity acting on the treatment liquid. In this way, the substrate can be excellently dried while preventing incomplete drying. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251840(A) 申请公布日期 2008.10.16
申请号 JP20070091455 申请日期 2007.03.30
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KAJINO KAZUKI;HOSOKAWA AKIHIRO;TERAJIMA KOZO
分类号 H01L21/304 主分类号 H01L21/304
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