| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a deburring method for easily performing the removal of resin burrs generated in the process of resin sealing, and to provide a method for manufacturing a semiconductor device. <P>SOLUTION: According to the present invention, in separating resin burrs 24 from a resin sealing body 12, the junction parts between them are irradiated with laser or the like to be partially melted. After that, a mechanical external force is applied to the resin burrs, and thereby the resin burrs 24 are separated from the resin sealing body 12. Thus, even if the resin burrs 24 are relatively thick, the damage caused to the resin sealing body 12 that is a product can be reduced in removing the resin burrs 24, so as to improve the yield. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
