| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of forming minute unevenness on the rear surface of a semiconductor wafer, and to provide a manufacturing method thereof. SOLUTION: The electrostatic chuck 6 for holding a semiconductor wafer 1 is provided with a plurality of protrusions 15 provided on the surface region contacting the semiconductor wafer 1. When the semiconductor wafer 1 is chucked with the heated electrostatic chuck 6, the semiconductor wafer 1 is rapidly heated and thermally expanded, and thus, the protrusions 15 of the electrostatic chuck 6 can form the minute unevenness on the rear surface of the semiconductor wafer 1. COPYRIGHT: (C)2009,JPO&INPIT |
