发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which enables the in-plane uniformity of a substrate processing by processing a liquid to be improved, and also to provide a substrate processing method. SOLUTION: The supply position on a wafer surface to which the jet stream of the liquid droplet of medical solution from a two-fluid nozzle is introduced moves while drawing the trajectory of an arc shape in a range from the rotating center of the wafer to the circumferential part of the wafer. The concentration of a pharmaceutically effective component which is supplied to the wafer from the two-fluid nozzle is made to increase as the supply position of the medical solution separates from the rotation center of the wafer. The more distant the surface position of the wafer becomes from the rotation center, the faster it moves. Accordingly, the amount of the pharmaceutically effective component of the medical solution per a unit area becomes almost equal over the whole area of the wafer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008246319(A) 申请公布日期 2008.10.16
申请号 JP20070088731 申请日期 2007.03.29
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 TOKURI KENTAROU
分类号 B05C11/08;G02F1/13;H01J9/20;H01J11/02;H01J11/34;H01J11/44;H01L21/027;H01L21/304 主分类号 B05C11/08
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