| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic circuit to a substrate capable of hardening an ACF of the periphery of the electronic circuit by keeping electrical connection between the electronic circuit and electrodes on the substrate to alleviate the warpage of the substrate even if an area of the ACF is arranged wider than that of an arrangement position of the electronic circuit. SOLUTION: The ACF 3 and an LSI 4 are arranged on a first substrate 1, and the LSI 4 is depressed to the first substrate 1 by heating the ACF 3 by a first heat tool 5. After that, the first substrate 1 is moved to a glass table 8, and the ACF 3 is heated by infrared light irradiated from a lamp 9. At this time, the LSI 4 is heated and depressed to the first substrate 1 by a second heat tool 7. COPYRIGHT: (C)2009,JPO&INPIT
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