| 摘要 |
<p>A LED(Light Emitting Diode) module for illumination is provided to prevent the drop of brightness of the module and generate light with high brightness by coating a transparent gel typed silicon based material and a compound having silicon and phosphor on the LED device. A LED(Light Emitting Diode) module for illumination comprises first, second, and third layers. The first layer has metal PCBs(Printed Circuit Board,2,7) on which heating members are mounted. The second layer is connected with LED devices(8) and PCB patterns(6) by gold wires(5), which are laminated on epoxy resins(9) in which Ag particles are contained. The second layer is filled with a transparent gel typed silicon based material. The third layer is made of a compound(3) having silicon(4) and phosphor. An average diameter of the Ag particle is 20 to 400 nm. The transparent gel typed silicon based material is coated on the LED device uniformly.</p> |
