POLYAMIDE RESIN COMPOSITION FOR PORTABLE ELECTRONIC DEVICE AND MOLDED ARTICLE FOR PORTABLE ELECTRONIC DEVICE

摘要

Disclosed is a polyamide resin composition which contains a glass fiber and therefore has particularly excellent strength and low warpage property and can be used suitably as a material for a portable electronic device which becomes increasingly thinner and lightweight. The polyamide resin composition comprises a polyamide resin (A) and a glass fiber (B) having an elongated ellipse cross-section with an aspect ratio defined by the formula below of 2.5 or more, and optionally a glass fiber (C) having a circular cross-section with a diameter of 3 to 30 mum, wherein the ratio between the components (B) and (C) (i.e., the (B):(C) ratio) is 3:7 to 10:0 (by weight), the proportion of the component (A) is 60 to 34% by weight, and the proportion of the component (B) or the sum of the components (B) and (C) is 40 to 66% by weight (relative to 100% by weight of the sum total of all of the components above). The polyamide resin composition shows a tensile strength of 200 MPa or higher as measured using an ISO test strip. Aspect ratio = [length of major axis of glass fiber (D2)]/[length of minor axis of glass fiber (D1)]