WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

A wiring distribution board and a method for manufacturing the same are provided to improve the accuracy of the alignment by implementing a thin substrate. A wiring distribution board includes a resin layer(105), an alignment mark(103), and an electrode pad(104). The alignment mark and the electrode pad are buried on the resin layer. One surface of the alignment mark and one surface of the electrode pad are exposed from the resin layer. An exposed plane of the resin layer has a different roughness from at least one exposed plane of the alignment mark and the electrode pad. At least one surface roughness of the alignment mark and the electrode pad is smaller than the surface roughness of the resin layer. The electrode pad is used as the electrode pad.