发明名称 Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip
摘要 A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.
申请公布号 US7437029(B2) 申请公布日期 2008.10.14
申请号 US20060279004 申请日期 2006.04.07
申请人 INFINERA CORPORATION 发明人 JOYNER CHARLES H.;KISH, JR. FRED A.;PETERS FRANK H.;MATHUR ATUL;WELCH DAVID F.;DENTAI ANDREW G.;LAMBERT DAMIEN;SCHNEIDER RICHARD P.;MISSEY MARK J.
分类号 G02B6/12;H01S5/026;H01S5/0625;H01S5/10;H01S5/12;H01S5/20;H01S5/22;H01S5/40 主分类号 G02B6/12
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