| 摘要 |
PROBLEM TO BE SOLVED: To bore a through hole of minute diameter having the same diameter of 50μm or less from one opening to the other opening, which was difficult to bore in the prior arts, and to make the interior of the hole visible. SOLUTION: Metal wires 19 of a desired minute diameter are arranged, at a desired pitch, on one plane of a first resin base material 13, one plane of the first resin base material 13 on which the metal wires 19 are arranged and one plane of a second resin base material 14 of the same material as that of the first resin base material are bonded through an adhesive principally comprising the first and second resin base materials and integrated. Subsequently, the first and second resin base materials 15 thus integrated are cut in a desired thickness, and the first and second resin base materials 17 thus integrated are immersed in etching liquid in order to dissolve the metal wires 19 thus producing a resin base material 18 having a through hole of a minute diameter. COPYRIGHT: (C)2009,JPO&INPIT |
