| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of wrinkles in a metal layer, and to form a reliable circuit pattern without deteriorating the degree of freedom when designing a circuit pattern. SOLUTION: A method of manufacturing a divided substrate includes a metal layer formation process, a press process, and a circuit formation process. In the metal layer formation process, the metal layer 68 is formed on a formation surface 4b of a press mold 4 having the formation surface 4b with a plurality of formation sections 4a comprising a projection in a shape corresponding to a three-dimensional shape section 6a of each separate board piece. In the press process after the metal layer formation process, presswork is performed by allowing the formation surface 4b of the press mold 4 to abut on one surface of a resin substrate 67 having size corresponding to a plurality of divided substrates, and the metal layer 68 is transferred onto the entire region of one surface of the resin substrate 67, thus forming a laminated substrate 60, where the resin substrate 67 and the metal layer 68 are laminated, and forming the three-dimensional shape section 6a by the formation section 4b. In the circuit formation process after the press process, patterning is performed to the metal layer 68 of the laminated substrate 60, thus forming the circuit pattern. COPYRIGHT: (C)2009,JPO&INPIT
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