发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable the exfoliation of an outer electrode terminal from an electrode pad to be prevented also from tensile force and bending force by a method wherein the required part of the outer electrode terminal is provided with an absorbtion part that absorbs tensile force or bending force. CONSTITUTION:The required part of the outer electrode terminal 1, such as the neighborhood of the junction plane of an electrode pad 3, is provided with a bent part 1b as the absorption part that absorbs tensile force or bending force, which part 1b is filled with a resin 7 to its upper part. This makes it difficult that the outer electrode terminal 1 comes off, when a tensile force acts on this terminal 1, because of being supported at the burial section of the bent part 1b. On the other hand, even when a bending force acts on the terminal 1, the force does not act on the junction because of absorption of the stress at the bent part 1b; accordingly, a high mechanical strength can be obtained.
申请公布号 JPS60157245(A) 申请公布日期 1985.08.17
申请号 JP19840013714 申请日期 1984.01.25
申请人 MITSUBISHI DENKI KK 发明人 OBARA MASANOBU
分类号 H01L23/50;H01L23/28;H01L23/49 主分类号 H01L23/50
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