| 摘要 |
PROBLEM TO BE SOLVED: To provide an interlayer connection bonding sheet for manufacturing a high density and high level multilayer wiring circuit board having extremely interlayer bonding reliability and interlayer connection reliability. SOLUTION: The interlayer connection bonding sheet for multilayer wiring circuit board is formed by laminating an alkenylphenol compound and a bonding layer containing maleimide or the like at least on a single surface of an insulating base material formed of a resin composition. This interlayer connection bonding sheet for multilayer wiring circuit board is characterized in that any process of the primer process, corona process, and plasma process is conducted at least to a single surface of the insulating base material. COPYRIGHT: (C)2009,JPO&INPIT |
