| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation mechanism capable of installing a heat sink even in the case a space is not available on a printed wiring board. SOLUTION: The heat radiation mechanism 18 comprises a printed wiring board 25, a circuit component 26 to be mounted on the printed wiring board 25, and a heat sink 27 for cooling down the circuit component 26. The heat sink 27 disposed between the printed wiring board 25 and the circuit component 26 has a first portion 31 for placing the circuit component 26 and a second portion 32, extending from the first portion 31 in the direction to be separated from the printed wiring board 25. COPYRIGHT: (C)2009,JPO&INPIT |
