CURABLE EPOXY RESIN COMPOSITION

摘要

Curable epoxy resin composition, which comprises: i) at least one diglycidyl ether of bisphenol A (DGEBA) and at least one diglycidyl ethers of bisphenol F (DGEBF) as epoxy resins, wherein the weight ratio of DGEBA : DGEBF is within the range of about 15:85 to 45:55; ii) an anhydride hardener; iii) at least one plasticizer; iv) optionally a catalyst, at least one filler material and/or further additives; and wherein the dynamic complex viscosity value (?*) of said composition is within the range of 0.1 to 20 Pa. s; a process for making said composition and electrical articles containing an electrical insulation system made from said composition.