| 摘要 |
A power semiconductor arrangement, comprising: at least one power semiconductor element (6); a clamping device, comprising a first clamping element (1) and a second 5 clamping element (2), said power semiconductor element (6) being arranged between said first and second clamping elements (1, 2), and; at least one spring element (4) arranged between said first clamping element (1) and said power semiconductor element (6), wherein said at least one spring element (4) presents at least one support surface with which it bears against at least one corresponding support surface of an adjacent element. The at least one support surface of said at least one spring element is laterally stationary arranged in relation to said at least one corresponding support surface upon compression motion of said spring element. |
