| 摘要 |
A method of manufacturing a crystal oscillator, in which method semiconductor components and the crystal or another resonator (1) are joined to a bottom base (4), most suitably to the printed circuit board material. The components (2, 3, 5) are joined by soldering or gluing to said bottom base and the crystal and another resonator (1) are installed, in regard to other components (2, 3, 5), using the bottom base area on the same spot.
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