发明名称 INSPECTION APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide an inspection apparatus which can directly obtain a fact whether a mounting table has reached the amount of overdrive or not even when an inspected body and a probe card touch collectively. SOLUTION: The inspection apparatus 10 comprises a mounting table 11, a probe card 12 and a controller 14, and under control of the controller 14, the mounting table 11 is overdriven to electrically touch a wafer W and the probe card 12 collectively. In such an apparatus for inspecting the electrical characteristics of the wafer W, displacement sensors 20 for measuring the distance between the mounting surface of the mounting table 11 and the lower surface of the card holder 15 of probe card are provided at three positions on the outside at the outer circumferential edge of the mounting table 11, and the controller 14 controls the amount of elevation of the mounting table 11 based on the measurement of the displacement sensor 20. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008243861(A) 申请公布日期 2008.10.09
申请号 JP20070077924 申请日期 2007.03.23
申请人 TOKYO ELECTRON LTD 发明人 YAMADA HIROSHI
分类号 H01L21/66;G01R31/28 主分类号 H01L21/66
代理机构 代理人
主权项
地址