| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible substrate, which can inhibit a plating failure from occurring. SOLUTION: The method for manufacturing the flexible substrate comprises the steps of: electrically connecting wiring patterns 12 and 16 formed on a first flexible substrate 10a and wiring patterns 12 and 16 formed on a second flexible substrate 10b through an electroconductive adhesive layer 20a, by providing the electroconductive adhesive layer 20a on the first flexible substrate 10a and the second flexible substrate 10b in a state that the back end face of the first flexible substrate 10a is butted against the front end face of the second flexible substrate 10b; and forming an electrolytically plated layer on wiring patterns 12, 14 and 16 by immersing the first flexible substrate 10a and the second flexible substrate 10b into an electrolytic plating tank while moving them with rollers including an electrode roller, and applying voltage to the wiring patterns 12 and 16 through the electrode roller. COPYRIGHT: (C)2009,JPO&INPIT
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