| 摘要 |
A semiconductor inspection apparatus includes a force probe applying voltage to a semiconductor device, and a sense probe detecting voltage of the semiconductor device, in which the force probe is contacted with an electrode pad of the semiconductor device and the force probe and the sense probe are contacted with each other to measure electric characteristics of the semiconductor device, and the force probe and the sense probe are arranged substantially on the same line when seen from a vertical direction with respect to an electrode surface (principal surface) of the semiconductor device.
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