ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTING ELECTRONIC DEVICE, ARTICLE MOUNTING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

An electronic device in which bending stress to a circuit chip is reduced and disconnection of a conductor pattern is avoided. The electronic device comprises a base (11), a conductor pattern (12) wired on the base, a circuit chip (13) connected electrically with the conductor pattern (12), a reinforcing body (16) consisting of a plurality of layers (16a, 16b) laminated in the thickness direction of the base (11) while having annular external form and arranged on the base (11) to surround the circuit chip (13) wherein the lowermost layer (16a) on the base (11) side in the plurality of layers is softer than at least any one layer (16b) in the remaining layers, and a body (15a) sealing the circuit chip (13) on the base (11) to cover the upper part of the circuit chip (13) while burying the inside of the reinforcing body (16).