| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve quality and productivity of a semiconductor device by suppressing resin flash generated when resin-sealing by a transfer molding method. <P>SOLUTION: A wiring substrate 1 comprises an element mounting region 5, a wiring 3 comprising a plurality of connection terminals 6 inside or on the outer peripheral side of the element mounting region 5, and insulating films 11 and 12 which cover the substrate surface so that the connection terminals 6 are exposed. Relating to the insulating films 11 and 12, a first wall part 12a which is frame-like and encloses a terminal formation region and a second wall part 12b positioned on its outer peripheral side are formed in protruded shape. The first wall part 12a comprises a groove 15 that goes across the direction connecting the terminal formation region with the outer end of the substrate, and the second wall part 12b faces the end part of the groove 15 with a space in between. Thus, when resin-sealing after a semiconductor element is mounted on the element mounting region 5, the air in the cavity of a mold can be discharged through the groove 15. Since the resin which tends to flow out through the groove 15 is stopped with the second wall part 12b, the occurrence of resin flash can be suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
