| 摘要 |
An isolated solder pad is provided to define a contact region on a lead by controlling non-uniform stand-off height between the lead and a die in an FCOL(Flip-Chip-On-Lead). A die(320) includes a plurality of I/O pads(318) formed on an active surface thereof. A lead frame includes a plurality of leads(208). Each of the leads has at least one or more related solder pad(212) and a contact surface isolated from the solder pad. The solder pad is properly positioned to overlap the corresponding I/O pad on the die. The lead has a recessed region(214) adjacent to the solder pad such that the surface of the solder pad is isolated from other surfaces of the lead. A plurality of solder bumps(316) are arranged to connect electrically the related I/O pad to the related solder pad on the lead frame. The solder of each solder bump in contact with the associated lead is confined to the surface of the related solder pad. An encapsulant material is used for encapsulating the solder bumps and at least parts of the die and leads. |
