SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package and a method for manufacturing the same are provided to prevent the leaning of a conductive wire having a long length by arranging a support member on an upper surface of a lower semiconductor chip. Bonding pads(15) are arranged at an edge of a base substrate(10). A lower semiconductor chip(20) is mounted on the base substrate. The lower semiconductor chip and the bonding pads are electrically connected to each other. A support member(40) is arranged on the base substrate. The support member exposes the bonding pads and covers the lower semiconductor chip and the base substrate. An upper semiconductor chip(50) is mounted on the support member. A flexible wire fixing member(45) is arranged on the support member. A conductive wire crosses the flexible wire fixing member to electrically connect the upper semiconductor chip to the bonding pad. The wire fixing member is hardened. Before the wire fixing member is hardened, a spacer is arranged on the lower semiconductor chip.