发明名称 |
Semiconductor device, its manufacture method and electronic component unit |
摘要 |
A LED chip having first and second electrodes on opposite principal surfaces, is bonded to a substrate through a composite bonding layer. The composite bonding layer is formed when a support substrate including the substrate and a first bonding layer is bonded to a lamination structure including the LED, the first electrode and a second bonding layer. The first or second bonding layer contains at least part of eutectic composition. At least one of the support substrate and the lamination structure includes a diffusion material layer. The composite bonding layer is formed in such a manner that eutectic material contents are mixed with the other to form a first mixture, and that the first mixture is mixed with diffusion material to form a second mixture having a melting point higher than a melting point of the first mixture. |
申请公布号 |
US7429754(B2) |
申请公布日期 |
2008.09.30 |
申请号 |
US20050204527 |
申请日期 |
2005.08.16 |
申请人 |
STANLEY ELECTRIC CO., LTD. |
发明人 |
SONODA JUNICHI;KOBAYASHI SEIICHIRO;YOSHIMIZU KAZUYUKI |
分类号 |
H01L27/15;H01L31/12;H01L33/10;H01L33/30;H01L33/40;H01L33/62 |
主分类号 |
H01L27/15 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|