发明名称 |
Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip |
摘要 |
In a multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip, in the case where not only a logic circuit of a first chip but also a logic circuit of a second chip requires an input signal, the multi-chip packaged integrated circuit device transmits the input signal to one or both of the logic circuits of the first and second chips via a synchronizer. In a case where three or more chips are integrated into the multi-chip packaged integrated circuit device, the input signal can be selectively transmitted to one or more of the three or more chips via the synchronizer.
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申请公布号 |
US7429794(B2) |
申请公布日期 |
2008.09.30 |
申请号 |
US20050157500 |
申请日期 |
2005.06.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
RYU JUNG-SU;KIM BYEONG-YUN;KIM YOUNG-DAE |
分类号 |
H01L23/34;H01L23/48;G11C29/48;H01L25/18 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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