发明名称 Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip
摘要 In a multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip, in the case where not only a logic circuit of a first chip but also a logic circuit of a second chip requires an input signal, the multi-chip packaged integrated circuit device transmits the input signal to one or both of the logic circuits of the first and second chips via a synchronizer. In a case where three or more chips are integrated into the multi-chip packaged integrated circuit device, the input signal can be selectively transmitted to one or more of the three or more chips via the synchronizer.
申请公布号 US7429794(B2) 申请公布日期 2008.09.30
申请号 US20050157500 申请日期 2005.06.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 RYU JUNG-SU;KIM BYEONG-YUN;KIM YOUNG-DAE
分类号 H01L23/34;H01L23/48;G11C29/48;H01L25/18 主分类号 H01L23/34
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