| 摘要 |
The object is to provide copper foil of high adhesion even when the roughness R z of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A (S), and a roughness R z (S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness R z (S) is 1. 0 µm to 3.0 µm, 0.5 × R z S + 0.5 ‰¤ C S where R z (S) is a numerical value represented by µm. |
