METHOD FOR MANUFACTURING PROBE CARD AND PROBE CARD THEREBY

摘要

A method for manufacturing a probe card and a probe card thereof are provided to realize the excellent uniformity of a body unit by forming an upper end of a tip unit using a sacrificial substrate. A first photoresist layer is formed to be patterned so that a first bump region communicating with an upper surface terminal(152) of a substrate connected to a wire unit(151) in a substrate(100) is excluded. A second photoresist layer is formed to be patterned so that a body unit region extended in one or more directions from the first bump region is excluded. The second photoresist layer includes the first bump region. A conductive material is gap-filled into the first bump region and the body unit region to form a bump and a body unit of a probe at the same time. A third photoresist layer is formed to be patterned so that a tip unit region of an upper surface of the body unit is excluded. A conductive material is gap-filled into the tip unit region to form a first tip unit of the probe. A trench is formed on the sacrificial substrate. A conductive material is gap-filled into the trench to form a second tip unit of the probe. The second tip unit of the probe is joined to the first tip unit of the probe.