| 摘要 |
A method for manufacturing a probe card is provided to reduce a void upon forming of a probe tip unit by manufacturing the probe tip unit and the body unit, separately. A first photoresist layer is patterned to exclude a first bump region, which is communicated with an upper surface terminal(152) of a substrate connected to a wire unit(151) in a substrate(100), and is formed. A second photoresist layer is formed to be patterned so that a body unit region extended in one or more directions from the first bump region is excluded. The second photoresist layer includes the first bump region. A conductive material is gap-filled into the first bump region and the body unit region to form a bump and a body unit of a probe at the same time. A trench is formed on a sacrificial substrate. A conductive material is gap-filled into the trench to form a probe tip unit. The probe tip unit is joined to the probe body unit.
|
