发明名称 COOLING MECHANISM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a technology capable of effectively cooling an electronic part such as a CPU, preventing the thermal damage of the electronic part and improving durability. <P>SOLUTION: A cooling mechanism for cooling the electronic part has a first duct 1 fitted so that the outlet side faces the electronic part for introducing a cooling fluid to the electronic part and a second duct 2 fitted in the first duct 1 and having a small bore. The cooling mechanism further has a first fan 4 fitted corresponding to the inlet side of the first duct 1, a second fan 5 fitted corresponding to the outlet side of the second duct 2 and a third fan 6 fitted corresponding to the inlet side of the second duct. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008218543(A) 申请公布日期 2008.09.18
申请号 JP20070051026 申请日期 2007.03.01
申请人 NEC CORP 发明人 MITSUI TOMOYUKI
分类号 H01L23/467;H05K7/20 主分类号 H01L23/467
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